Silicon free gap filler pads are thermal interface material that are treated with special resins based on metal oxides and special additives, and are often referred to as non silicon thermal pads, silicone free thermal pads, etc. in the industry. Silicone free thermal pads is a soft, silicone free gap filling thermally conductive material with high thermal conductivity, low thermal resistance, high compressibility, controllable hardness, and no silicone small molecules in the pressurized and heated operating environment volatile, to avoid adsorption on the PCB board due to the volatilization of small siloxane molecules, which indirectly affects the performance of the body. The silicon free thermal pads acts on the gap between the heat source and the radiator/housing. Due to its good softness, it can effectively remove the air at the interface, reduce the thermal resistance of the interface, and improve the thermal conductivity.

The material of the silicone free thermal pads does not contain any silane forming molecules at all, so there is no need to worry about circuit failure caused by the precipitation of silicone oil or the volatilization of siloxane. It has very good tensile strength and elongation, and at the same time inherits the high thermal conductivity of thermal silicone pads. Performance and good electrical insulation properties.

silicone free thermal pads, compared with traditional silicone thermal pads, the obvious advantage of silicone free thermal pads is that the content of low molecular siloxane is zero, which solves the problem of silicone oil volatility that many engineers worry about. After long term repeated tests, the low-molecular weight siloxane did not precipitate, which is much better than the silicone thermal pads used before, and the thermal conductivity is also 3.0w/m.k. Not only the temperature is lowered better, but also the PCB board can be removed after rework. Also very clean with no dirt on it.

Our silicone free thermal pads are very soft which is beneficial for reducing applied stress on the PCB and lowering the thermal resistance. That aid in the dissipation of heat from intended targets to cooler surface areas within an electronic device. They are often used to cool SSD (solid state drives) or can be attached to the bottom of heatsinks, to act as a thermal interface bridge between surfaces to accommodate thermal conductivity to alleviate over heating of an electronic device.

Features

• Silicone free, thermal conductivity: 3W/m.K

• Low dielectric constant

• Differential tack option available for easy assembly and rework

• Minimal compression set

• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

Applications

• Products that are afraid of silicone oil contamination

• Optical precision equipment

• laptop, projector

• Mobile and communication equipment, high-speed mass storage drives, heat pipe components, automotive engine control equipment, telecommunications hardware and equipment, high-end industrial control and medical electronics, etc.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.

Now price of silicone-free thermal interface material is reasonable. If you want to buy a non-silicone thermal interface material, please contact us.

A thermal pad gap with low oil-bleed and low oil migration is typically designed to address concerns in high-performance applications where oil contamination can affect both thermal conductivity and the longevity of the material. This type of gap pad is often used in situations where there's concern about oil or other fluids interfering with the pad’s properties, such as in automotive, industrial, or power electronics.

Low Oil Bleed

This refers to the thermal pad's ability to resist releasing oils or other liquids over time, especially when exposed to heat. Pads with low oil bleed are more stable in high-temperature environments, ensuring that they maintain their thermal conductivity and do not degrade or interfere with surrounding components.

Low Oil Migration

Migration refers to the tendency of oils to move from the pad into the surrounding area, potentially contaminating other components, leading to poor performance or reliability issues. Pads designed with low oil migration properties ensure that the oil stays within the pad and doesn't migrate, preventing damage to sensitive electronics.

Common Materials

Silicone-based Pads: These typically have better oil resistance, as they contain less volatile compounds, but care must be taken in choosing formulations that do not "bleed" oil over time. Polymer or Elastomer-based Pads: These materials can also provide low oil migration and bleed properties, with added benefits of lower compressibility and higher durability.

Applications

Automotive Electronics: In areas where engine or transmission heat may cause thermal pads to be exposed to oil or other fluids, using a thermal gap pad with these properties is critical. Power Electronics & Industrial Equipment: In environments with high temperatures and possible exposure to oils or other fluids, these pads ensure efficient heat transfer without contaminating surrounding components.

Thermal interface material manufacturers may use a combination of cross-linking agents or specific filler materials to enhance oil resistance while maintaining a balance between thermal performance and physical properties.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com

Thermal conductivity and thermal impedance are two important parameters used to describe the performance of thermal pads. Thermal conductivity refers to the ability of a thermal material to conduct heat. A thermal pad with high thermal conductivity will transfer heat more effectively from one surface to another.

Thermal impedance, on the other hand, is a measure of how much a material resists the flow of heat. A thermal pad with low thermal impedance will allow heat to flow more easily through it, resulting in better heat dissipation. Across the industry, thermal interface material manufacturers often publish thermal conductivity in units of Watts / meter-Kelvin as well as thermal impedance in units of °C – inches2 / Watt on their datasheets.

Thermal conductivity is a material property and describes the ability of the given material to conduct heat. Therefore, when a material’s thermal conductivity is high, the material is a better thermal conductor. This property is independent of material size, shape or orientation in a homogeneous material, and because of this, thermal conductivity is an idealized value. Thermal resistance is another inherent thermal property of a material, and is the measure of how a material of a specific thickness resists the flow of heat. Since thermal pad thickness is directly related to the resistance, thinner thermal pads transfer heat more efficiently than thicker ones.

Contact resistance is specific to the interfaces where a pad meets the heat-generating component and the heat sink. In reality, neither of these components are perfectly flat or smooth, therefore these surface irregularities create micro-air voids when in contact with the interface material, reducing the effectiveness to transfer the heat (air is a very poor thermal conductor).

Therefore, the thermal impedance of a material is the sum of its thermal pad thermal resistance and all contact resistances. When a material’s thermal impedance is lower, the material is a better thermal conductor in that application. Based on this, it's understandable that factors such as surface roughness, surface flatness, clamping pressure, presence of adhesive, non-homogeneous, and material thickness all have large impacts on the material’s thermal impedance. In summary, thermal conductivity measures how well a material conducts heat, while thermal impedance measures how much it resists the flow of heat. Both parameters are important in evaluating the performance of thermal pads.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.

Thermal gap pads are designed to fill the gaps between two surfaces. The thermal gap pads are not perfectly uniform, they may have voids and gaps in-between them hence why compressing them makes them more uniform. And require compression to achieve their rated thermal conductivity. The compression helps to remove any air pockets that may exist between the surfaces, allowing for better heat transfer.

Thermal conductivity of air gap is only one factor to consider when selecting a gap pad. Thickness, hardness, compression and the actual gap between the two surfaces also affect the final thermal performance. When comparing materials, gap pad thermal conductivity should therefore be considered together with the mechanical requirements of the assembly.

As you can see, the more the pads were compressed, the higher the thermal conductivity (or lower the thermal impedance) became. Thermal impedance is the inverse of thermal conductivity, so in the test, thermal impedance lower is better.

We recommend a 5~25% thermal gap pad compression. Even though some thermal pads can be compressed up to 70%, too much compression can break solder joints, damage PCB modules, etc. So going too thick, applying too much compression is dangerous.

Thermal conductivity is only one mechanical property to take a look at when buying replacement thermal pads. Thickness, the compression it was tested at and the hardness will also play a factor in your performance. Every electronic applications will be built differently with different gap sizes. Determining the best thermal pad solution will require a little bit of thinking.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.